warm components mounted on underside for better cooling

[cedric]

Hi All,

I have already asked this on the A20 support section, but I think this is a better place. Appologies for the cross post.

I think it would be nice to have the SOC on one side of the board, and all the tall components on the other. The idea is that the SOC is the tallest component on the bottom side. Then any flat heat sink can be used to cool the SOC. Now the size of the heat sink is dictated by the nearest tall component.

I wonder, what are the reasons not to do this?

Kind regards,
Cedric